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DAC 2013 AUSTIN, TX | JUNE 2-6

Work-In-Progress (WIP)

Work-In-Progress (WIP) Abstracts 

In contrast to other tracks at DAC, this track aims to provide authors an opportunity for early feedback on work-in-progress or to share early results. 

  • A WIP submission must be one page in length, in PDF format, and clearly specify a technical problem, outline a solution, and provide some early results. 
  • WIP submissions will be accepted for presentation at a poster session. 
  • A WIP submission will not be included in the DAC proceedings. 
  • The 100-word summary abstract will be published on the website. 
  • A WIP presentation at DAC is not considered a DAC publication. 
  • WIP submissions will be reviewed by the Technical Program Committee and expert external reviewers, but no specific feedback will be provided. 
  • Acceptance notices will be available by logging in to the DAC website after April 16, 2012. 
  • WIP authors are at liberty to submit an extended version of their work to other conferences and to journals without violating common codes of ethics.
  • WIP submissions received by the WIP deadline are expected to be competitive with the WIP pre-selected submissions.

Some authors of submitted DAC research and embedded systems and software manuscripts that are not accepted for publication in 2012 will be given “WIP pre-selected” status.
These authors will be invited in mid-February 2012 to participate in the WIP poster sessions.
The authors will be asked to submit a 100-word summary abstract to be published on the website (and not in the proceedings).  The number of planned poster sessions will be commensurate with the quality of WIP submissions.

ACM and IEEE does not consider WIP such material as a publication, however, please verify double-submission policies of other conferences, workshops, and journals.

TOPIC AREAS:

Electronic Design Automation (EDA)

SUBMISSION CATEGORIES FOR EDA PAPERS
Authors of research papers are required to specify a category from the list below. Authors of submissions that cover cross-cutting topics (e.g. low-power, reliability, 3-D, etc.) should select a category that is closest to the essential contribution of the submission. Authors may choose a second submission category to accommodate cross-cutting contributions. Please note the separate categories for embedded systems and software topics.

EDA1. System-Level Design & Codesign
EDA1.1 System specification, modeling, simulation, verification, and performance analysis
EDA1.2 Scheduling, HW/SW partitioning, HW/SW interface synthesis
EDA1.3 IP and platform-based design
EDA1.4 Security and IP protection
EDA1.5 Design of Multiprocessor System-On-Chip (MPSOC)
EDA1.6 Application-specific processor design tools

EDA2. System-Level Communication and Networks-on-Chip
EDA2.1 Modeling and performance analysis
EDA2.2 Communications-based design, communication and network synthesis
EDA2.3 Optimization for energy, fault tolerance, reliability
EDA2.4 Interfacing and software issues, beyond-the-die communication
EDA2.5 NoC design methodologies, case studies and prototyping

EDA3. Power Analysis and Low-Power Design
EDA3.1 System-level power design and thermal management
EDA3.2 System/Architectural low-power techniques: partitioning, scheduling, and resource management
EDA3.3 High-level power estimation and optimization
EDA3.4 Gate-level power analysis and optimization
EDA3.5 Device and circuit techniques for low-power design
EDA3.6 Power-aware and energy-efficient wireless protocols, algorithms and design techniques

EDA4. Verification
EDA4.1 Functional, transaction-level, RTL, and gate-level modeling and verification of hardware design
EDA4.2 Dynamic simulation, equivalence checking, formal (and semiformal) verification model and property checking
EDA4.3 Emulation and hardware simulators or accelerator engines
EDA4.4 Modelling languages and related formalisms, verification plan development and implementation
EDA4.5 Assertion-based verification, coverage analysis, constrained random testbench generation

EDA5. High-Level Synthesis, Logic Synthesis, and FPGAs
EDA5.1 Combinational, sequential and asynchronous logic synthesis
EDA5.2 Library mapping, cell-based design and optimization
EDA5.3 Transistor and gate sizing, resynthesis
EDA5.4 Interactions between logic design and layout or physical synthesis
EDA5.5 High-level, behavioral, algorithmic, and architectural synthesis, “C” to gates tools and methods
EDA5.6 Resource scheduling, allocation, and synthesis
EDA5.7 Logic synthesis and physical design techniques for FPGAs
EDA5.8 Configurable and reconfigurable computing

EDA6. Circuit, Interconnect and Manufacturing Simulation and Analysis
EDA6.1 Electrical, thermal, and electro-thermal simulation
EDA6.2 Model order reduction methods
EDA6.3 Interconnect and substrate modeling and extraction
EDA6.4 High-frequency and electromagnetic simulation of circuits
EDA6.5 Process technology characterization, and modeling
EDA6.6 Technology CAD and fab automation

EDA7. Timing Analysis, Integrity and Design Reliability
EDA7.1 Deterministic and statistical timing analysis
EDA7.2 Signal integrity and substrate noise
EDA7.3 Power delivery analysis and optimization
EDA7.4 Electrical and thermal reliability
EDA7.5 Soft errors
EDA7.6 Novel clocking methodologies

EDA8. Physical Design
EDA8.1 Floorplanning, partitioning, placement
EDA8.2 Buffer insertion, routing, interconnect planning
EDA8.3 Physical verification and design rule checking
EDA8.5 Automated synthesis of clock networks
EDA8.6 Physical design of 3-D integrated circuits
EDA8.8 System-in-package design, package-board codesign

EDA9. Design for Manufacturability
EDA9.1 Reticle enhancement, lithography-related design optimizations
EDA9.2 Design for manufacturability, yield, defect tolerance, cost issues, and DFM impact
EDA9.3 Design for resilience under manufacturing variations

EDA10. Analog, Mixed-Signal, and RF
EDA10.1 Analog, mixed-signal, and RF design methodologies
EDA10.2 Automated synthesis
EDA10.3 Analog, mixed-signal, and RF simulation
EDA10.4 High-frequency design and advanced antenna design for wireless design

EDA11. Testing
EDA11.1 Test quality/reliability, current based test, delay test, low-power test
EDA11.2 Digital fault modeling, automatic test generation, fault simulation
EDA11.3 Digital design for test, test data compression, built-in self test
EDA11.4 Memory test and repair, FPGA testing
EDA11.5 Fault-tolerance and online testing
EDA11.6 Analog/mixed-signal/RF testing, system-in-package (SIP) testing
EDA11.7 Board- and system-level test, system-on-chip (SoC) testing
EDA11.8 Silicon debug and diagnosis, post-silicon design validation

EDA12. Design Automation for System & Synthetic Biology
EDA12.1 Design methodologies for system & synthetic biology
EDA12.2 Tools for engineering parts and devices
EDA12.3 Tools for protein and pathway engineering
EDA12.4 Tools for bridging experimental and computational frameworks

EDA13. New and Emerging Design Technologies (including but not restricted to)
EDA13.1 New transistor structures, devices, and novel process technologies
EDA13.2 Nanotechnologies, nanowires, nanotubes
EDA13.3 Optical devices and communication
EDA13.4 Quantum computing
EDA13.5 Biologically-based or biologically-inspired computing systems
EDA13.6 MEMS, sensors, actuators, imaging devices
EDA13.7 Cyber-physical systems

EDA14. EDA Wild and Crazy Ideas (WACI)

 

 

Embedded Systems and Software (ESS)

ESS1. Embedded System Specification and Software Engineering
ESS1.1 Domain-specific programming languages
ESS1.2 Software architectures and software engineering
ESS1.3 Model- and component-based embedded software design
ESS1.4 Software frameworks
ESS1.5 Hardware/software co-specification techniques

ESS2. Embedded Software
ESS2.1 Real-time operating systems and middleware
ESS2.2 Middleware and virtual machines
ESS2.3 OS Runtime support for resources management
ESS2.4 Software techniques for multicore, GPU, multithreaded embedded architectures
ESS2.5 Compilation strategies, code transformation and parallelization techniques for embedded systems
ESS2.6 Static and dynamic timing analysis for embedded systems
ESS2.7 Hardware-dependent software
ESS2.8 Customized interfaces and protocols
ESS2.9 I/O management in embedded systems: device drivers, timers, etc.

ESS3. Architectures for Embedded Systems
ESS3.1 Many- and multi-core embedded architectures
ESS3.2 Application-specific platforms and embedded processors (ASIP) design
ESS3.3. Design of heterogeneous distributed embedded systems including wireless sensor networks
ESS3.4 Run-time and design time reconfigurable platforms and processors
ESS3.5 Architectures for self-adaptive computing systems
ESS3.6 On-chip memory architectures and management: scratchpads, compiler controlled memories, etc.
ESS3.7 Custom storage organizations: flash, etc.
ESS3.8 Custom communication design

ESS4. Embedded System Validation, Verification, Security, Dependability
ESS4.1 Formal verification
ESS4.2 System validation
ESS4.3 Testing and regression analysis
ESS4.4 Hardware/software co-validation
ESS4.5 Hardware and software security and dependability techniques
ESS4.6 Verification techniques for software correctness

ESS5. Embedded Systems Platforms and Case Studies
ESS5.1 Platforms and design flows for domain-specific applications (e.g.,
avionics, automotive, medical, mobile, multimedia, etc.)
ESS5.2 IP-based design
ESS5.3 Rapid prototyping
ESS5.4 Packaging issues
ESS5.5 Case studies

ESS6. Embedded systems design methodologies
ESS6.1 Modeling embedded constraints: performance, reliability, power, security, etc.
ESS6.2 Early estimation and co-simulation of embedded systems designs
ESS6.3 Multiple-constraint-driven embedded system design exploration, synthesis and optimization
ESS6.4 Design methodologies for pervasive distributed networked embedded systems
ESS6.5 Design methodologies for runtime reconfiguration management, self-adaptive systems and autonomous embedded systems
ESS6.6 System level power management and optimization in embedded systems

ESS7. Embedded Systems and Software (ESS) Wild and Crazy Ideas (WACI)


 

 




Q. What is a Work in Process (WIP) Presentation?

A. The purpose of WIP is to allow the community to participate in an interactive event at DAC, where participants have an opportunity to present and discuss their current work and early results. WIP sessions provide a forum for timely presentations, discussion, and feedback from the community.

Q. What are key dates associated with the WIP submission process?

TIMELINE:
 
DECEMBER 2011:
December 10: WIP submission site opens

MARCH 2012
March 12: Submission site closes
March 15: DAC Technical Program Committee reviews abstracts

APRIL 2012:
April 16: Accept/Reject notices sent to all authors
April 20: WIP sessions live on the DAC website!

Q. What does a WIP abstract look like?

A.The one page document must be in PDF, in single- or double-column format. The submission needs to provide some details so the Technical Program Committee can evaluate the potential quality and interest in your poster at DAC. Each submission is expected to include the following details:
  1. A title.
  2. Name, affiliation, and email addresses for all authors.
  3. An introduction that specifies the context and motivation of the submission.
  4. An outline of the problem being solved.
  5. Highlights of the proposed solution.
  6. A summary that highlights early results.
  7. One or two references, if appropriate.

You may include up to two additional pages of diagrams, figures, or pictures, as you find appropriate.

Q. What are the abstract categories?

A. Please see the categories under the Electronic Design Automation (EDA) research manuscript area in the Call for Contributions.

Q. Who judges the abstracts?

A. The Technical Program Committee for the research track and the embedded track will review the submissions, with the assistance of select expert reviewers.

Q. What criteria are used to judge WIP abstracts?

A. DAC-relevant motivation and context, clarify of problem statement, and promise of solution.

Q. I received a WIP pre-selected status through my research track submission. What does it mean?

A. Some authors of submitted DAC research and embedded systems and software manuscripts that are not accepted for publication in 2012 will be given "WIP pre-selected" status. These authors should have received an email invitation by mid-February 2012 to participate in the WIP poster sessions.

Q. I received a WIP pre-selected status through my research track submission. What should I do?

A. You will be asked to submit a 100-word summary to reserve your WIP slot, by March 12, 2012, 5:00pm MT (-07:00 GMT). The submission site is found on the call for contributions page under the “Work-In-Progress (WIP)” section of the accordion.

Q. Who do I contact for more information?

A. For additional information, please contact Soha Hassoun or Donatella Sciuto, 49th DAC Technical Program Co-Chairs.
SUBMISSIONS DUE BEFORE 5:00pm MT, (-07:00 GMT)
March 12, 2012 - CLOSED


Design Automation Conference Sponsors IEEE Solid State Circuits Society Electronic Design Automation Consortium CEDA - IEEE Council on Electronic Design Automation SIGDA Special Interest Group - Design Automation