Topics include: ESL Design and Prototyping, Low Power, SystemC for Multiple Domains, 3D ICs, and Software Development
LOUISVILLE, CO. –– June 8, 2010 –– The 47th Design Automation Conference (DAC), the premier conference devoted to electronic design and design automation, is pleased to offer five educational tutorial sessions. Tutorials provide an excellent opportunity for attendees to complement the technical program and vendor information with clear, informative education by domain experts. Topics are timely and relevant: four of the tutorials cover topics such as ESL design and prototyping, low power design, SystemC for multiple domains, and 3D integrated circuits (ICs). The fifth is focused on best practices in writing software, a topic that is useful and relevant to any EDA practitioner.
DAC will be held at the Anaheim Convention Center, in Anaheim, CA, from June 13th - 18th, 2010. Tutorials take place on Monday, June 14th and Friday, June 18th. On Monday, two full-day tutorials will be offered:
- Low Power from A to Z covers one of today’s “hottest” issues in design and design automation. Speakers from ARM, Cadence, Intel, Synopsys and Texas Instruments will provide a comprehensive overview of low-power approaches at all levels of the design process, from process technology to system architecture.
- ESL Design and Virtual Prototyping of MPSOCs will provide a comprehensive introduction to the fast-growing world of ESL design, presented by speakers from Univ. de Bretagne, Univ. Pierre et Marie Curie, Bull S.A.S., STMicroelectronics, and TIMA Labs. Attendees will learn about current ESL design techniques, future trends, and participate in exercises via a live CD distributed to all participants.
On Friday, the tutorial line-up includes the following two full-day tutorials:
- How to Write Better Software covers a topic that affects almost all EDA professionals, most of whom have been trained in technology and/or hardware. Yet many of those same professionals spend most of their time writing software. This tutorial, presented by members of IBM’s Quality Software Engineering team, is a condensed version of a two-day workshop that introduces state-of-the-art software development practices.
- 3D: New Dimensions in IC Design covers an emerging solution to meet the challenges of high performance, differentiated technology integration, and smaller form factors. Speakers from Ecole Polytechnique Fédérale de Lausanne, IBM, IMEC, Intel, and Penn State will provide an overview of 3D technology, the corresponding design challenges, and solutions for overcoming these challenges.
Also on Friday, there will be a half-day tutorial from 8:30am until 2:30pm:
- SystemC for Holistic System Design with Digital Hardware, Analog Hardware, and Software, presented by speakers from Fraunhofer IIS, Infineon Technologies, NXP Semiconductors, Tensilica, and Univ. of Erlangen-Nuremberg, will cover SystemC and the brand-new SystemC AMS standard. The tutorial will focus on the challenges of modeling very different domains (digital, analog, and software) in an effective way.
“The Executive and Tutorial Committees have put together a stellar program, with domain expertise imparted by speakers who represent a ‘who’s who’ in their respective areas,” said Robert Jones, DAC 2010 Tutorials Chair. “Combining the DAC technical program and vendor information with detailed, informative tutorials – at significantly less expense than bringing in experts for corporate training – is a great way to make the most of DAC!”
For more detailed information on an individual tutorial and to register to attend any of the tutorials, please visit www.dac.com.
Attendees of DAC Tutorials can earn university Continuing Education Credits (CEU) through University of California Extension, Santa Cruz and University of California Extension, San Diego.
About DAC The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for Electronic Design Automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its Exhibition and Suite area with approximately 200 of the leading and emerging EDA, silicon, IP and design services providers. The conference is sponsored by the Association of Computing Machinery/Special Interest Group on Design Automation (ACM/SIGDA), the Electronic Design Automation Consortium (EDA Consortium), and the IEEE Council on Electronic Design Automation (CEDA).
Design Automation Conference acknowledges trademarks or registered trademarks of other organizations for their respective products and services.
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For more information, please contact: Press@dac.com