SESSION 45: SPECIAL SESSIONS
3D-IC Design: Where Are We Going from Here?
Thursday, June 6, 2013
Time: 9:00 AM — 10:30 AM
Emerging Design Technologies
|Chair: ||Ibrahim (Abe) Elfadel - Masdar Institute of Science and Technology, Abu Dhabi, United Arab Emirates|
In the last several years, a lot of progress has been made in 3D integration from system-level design to fabrication technology. However, 3D-IC products are not making the large stride into the semiconductor market as expected. The reasons behind this may due to many factors including both technical and nontechnical challenges.
This session invites experts from both industry and academia to reflect on the most recent advancement in 3D integration, where 3D integration is heading, and what road blocks need to be removed along the way. The discussions will make specific connection to the design, tool, fabrication and test issues related to 3D-IC technology.
Where are all Those 3D Chips?
|Speaker: ||Robert Patti - Tezzaron Semiconductor, Naperville, IL|
|Author: ||Robert Patti - Tezzaron Semiconductor, Naperville, IL|
The Industry’s First 3D FPGA
|Speaker: ||Ephrem Wu - Xilinx, Inc., San Jose, CA|
|Author: ||Ephrem Wu - Xilinx, Inc., San Jose, CA|
3D - Waiting for Cost Learning to Occur?
|Speaker: ||Paul Franzon - North Carolina State Univ., Raleigh, NC|
|Author: ||Paul Franzon - North Carolina State Univ., Raleigh, NC|