1st Place (Best Overall)
A 50MS/s (35mW) to 1kS/s (15 µW) Power Scaleable 10b Pipelined ADC with Minimal Bias Current Variation
Imran Ahmed, David Johns - Univ. of Toronto, Toronto, ON, Canada
2nd Place – A 1.3 TOPS H.264/AVC Single-Chip Encoder for HDTV Applications
Tung-Chien Chen, Yu-Wen Huang, Chen-Han Tsai, Ching-Yeh Chen, To-Wei Chen, Liang-Gee Chen - National Taiwan Univ., Taipei, Taiwan
3rd Place – A Side-Channel Leakage Free Coprocessor IC in 0.18µm CMOS for Embedded AES-based Cryptographic and Biometric Processing
Kris Tiri, David Hwang, Alireza Hodjat, Bo-Cheng Lai, Shenglin Yang, Patrick Schaumont, Ingrid Verbauwhede - Univ. of California, Los Angeles, CA
1st Place – Design and Implementation of a Fractional-N Frequency Synthesizer for Cellular Systems
Petrus J. Venter, Saurabh Sinha - Univ. of Pretoria, Pretoria, South Africa
2nd Place – A 1-V IEEE 802.11a/b/g-Compliant Receiver IF-to-Baseband Chip in 0.35µm CMOS for Low-Cost Wireless SiP
Pui-In Mak, Rui P. Martins - Univ. of Macau, Macao SAR, China
Seng-Pan U - Chipidea Microelectronics (Macau) Ltd., Macao SAR, China
3rd Place – Collision Detection System using an FPGA Implemented on the FPX Platform
Hasan N. Atay, Burchan Bayazit, John W. Lockwood - Washington Univ., St. Louis, MO
42nd DAC SDC At-Conference Presenters: Bottom tier, left to right: Hasan Atay, Petrus Venter, Imran Ahmed, Kris Tiri, Ingrid Verbauwhede, Shenglin Yang, Tung-Chien Chen, Chen-Han Tsai, Pui-In Mak. Top tier, left to right: John Tanner, David Greenhill, John Lockwood, Cheryl Mendenhall, Karen Bartleson, Dale Edwards, Bo Cheng Lai, Ian Burgess, Saraju Mohanty, Jim Tschanz, Alan Mantooth
52nd DAC General Chair, Anne Cirkel, will be the featured editor of the "52 Weeks of DAC" blog. Follow this blog for a behind the scenes view of how this conference gets ready for June 2015!
DAC 2015 will be held in San Francisco, California, at the Moscone Center. Get details about travel, hotels, and area attractions in one convenient spot.
DAC provides many opportunities for in-depth learning.