Atrenta and TSMC Announce SpyGlass® IP Kit 2.0 Availability
Nov 1, 2012
SAN JOSE, Calif and HSINCHU, Taiwan, R.O.C. — Oct 31, 2012 — Atrenta Inc., the leading provider of SoC Realization solutions for the semiconductor and consumer electronics industries, with TSMC announced today the planned availability of IP Kit 2.0. Based on the SpyGlass® RTL design platform, IP Kit is a fundamental element of TSMC’s soft IP9000 Quality Assessment program that assesses the robustness and completeness of soft, or synthesizable IP. IP Kit 2.0 has undergone extensive beta testing by TSMC soft IP alliance partners: Digital Media Professionals Inc., Dolphin Integration, Sonics, Inc. and Vivante Corporation. IP Kit 2.0 will be fully supported on TSMC-Online and available to all TSMC’s soft IP alliance partners on Nov. 20, 2012.
Originally announced on May 26, 2011, TSMC’s soft IP quality assessment program is a joint effort between TSMC and Atrenta to deploy a series of SpyGlass checks that create detailed reports of the completeness and robustness of soft IP. Currently, over 15 soft IP suppliers have been qualified through the program. IP Kit 2.0 represents an enhanced set of checks that adds physical implementation data (e.g., area, timing and congestion) and advanced formal lint checks (e.g., X-assignment, dead code detection). IP Kit 2.0 also allows easier integration into the end user’s design flow and enhanced IP packaging options.
“The predictability of soft IP reuse continues to be a challenge for the SoC design community,” said Mike Gianfagna, vice president of corporate marketing at Atrenta. “Thanks to TSMC’s commitment to drive the quality of soft IP deliverables, we are making real progress toward improving soft IP reuse.”
“The soft IP9000 program has already had a positive impact on the delivered quality of soft IP for TSMC’s customers. The addition of physical implementation information and formal lint analysis will further enhance the effectiveness of the program,” said Suk Lee, senior director, Design Infrastructure Marketing Division at TSMC. “The beta test program went very smoothly. IP Kit 2.0 installed easily and ran with minimal issues during the beta test period for our selected soft IP alliance partners.”
IP Kit 2.0 is available from Atrenta. Admission into the soft IP qualification program is managed by TSMC. Contact Richard Lee (email@example.com) for further information on the program.
More information about the soft IP alliance partners who participated in the beta test program for IP Kit 2.0 is available on the accompanying sheet.
Atrenta’s SpyGlass® Predictive Analysis software platform significantly improves design efficiency for the world’s leading semiconductor and consumer electronics companies. Patented solutions provide early design insight into the demanding performance, power and area requirements of the complex system on chips (SoCs) fueling today’s consumer electronics revolution. More than two hundred companies and thousands of design engineers worldwide rely on SpyGlass to reduce risk and cost before traditional EDA tools are deployed. SpyGlass functions like an interactive guidance system for design engineers and managers, finding the fastest and least expensive path to implementation for complex SoCs.
SpyGlass from Atrenta: Insight. Efficiency. Confidence. www.atrenta.com
© 2012 Atrenta Inc. All rights reserved. Atrenta, the Atrenta logo, and SpyGlass are registered trademarks of Atrenta Inc. All others are the property of their respective holders.
This press release contains forward-looking statements. Atrenta disclaims any obligation and does not undertake to update or revise the forward-looking statements in this press release.
Digital Media Professionals Inc.
“DMP's proven track record for delivering the best quality IP to TSMC's customers is further strengthened by becoming a selected partner participating in IP Kit 2.0 beta testing. Having met this stringent criteria, DMP demonstrates it can deliver 3D/2D graphics IP which is not only cost effective and high performance, but also reliable and easy to integrate into customers' SoCs.”
Tatsuo Yamamoto, President & CEO, Digital Media Professionals Inc.
"After our cooperation with TSMC for the qualification of our libraries and mixed-signal IPs, Dolphin Integration has been pleased to join the TSMC soft IP quality assessment program as a beta tester. It was a new step in the strong guarantee of our microcontrollers. Indeed, the combination of SpyGlass and TSMC quality goals for the verification of our designs proves their robustness. Our customers are thus ensured of the easiest integration of the Flip80x51 family."
Olivier Montfort, Microcontroller Development Manager, Dolphin Integration
“With more than two billion chips using Sonics IP in the market today, we understand the importance of providing customers with the highest quality IP that meets the rigorous standards of SpyGlass IP Kit 2.0,” said Frank Ferro, director of product marketing, Sonics. “Today’s SoC designers have to evaluate an incredible amount of IP and with Sonics System IP, including our advanced on-chip networks, we help manage the complexity. We are thrilled to have been selected by Atrenta and TSMC to be a beta partner and look forward to strengthening our relationship by enhancing soft IP quality together.”
Frank Ferro, Director of Product Marketing, Sonics
“Vivante is pleased to be a lead partner in Atrenta and TSMC’s SpyGlass IP Kit 2.0 platform for soft IP quality assessment. As a global leader in GPU and OpenCL™ technologies, we need to ensure our designs meet stringent quality and reliability standards required by the world’s top SoC companies. By going through extensive validation of our IP on the SpyGlass platform, customers can be confident that selecting Vivante products meet those goals and minimize risk in the product lifecycle of their designs.”
Wei-Jin Dai, President and CEO, Vivante Corporation
For more information, contact:
Email: cpuri@atre nta.com