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DAC 2013 AUSTIN, TX | JUNE 2-6

Work-in-Progress (WIP)




DAC Work-in-Progress aims to provide authors an opportunity for early feedback on current work and preliminary results.

The authors are expected to present a poster at DAC. A 100-word summary abstract will be published on the DAC website, but the submission will not be included in the official DAC proceedings.

A WIP presentation at DAC is not considered a DAC publication. WIP authors are at liberty to submit a version of their work to other conferences and to journals without violating common codes of ethics.

Authors have two different opportunities to be part of the DAC Wip poster session.
Option 1: If you submit a research manuscript and it is not accepted as part of the regular technical program, authors can have a second opportunity to have their submission reviewed as part of the DAC wip poster session. Please select the following box "If not accepted as a Manuscript, please review for inclusion to the WIP program" when you are on the submission form.

Option 2: Authors must submit a 100 word abstract and a one page manuscript to be reviewed as part of the DAC Work-in-Progress Poster session. Submission should clearly specify a technical problem, outline a solution, and provide some early results. Please select the following box "Please review only as a DAC WIP" when you are on the submission form.

Acceptance notices and confirmation forms will be sent to the corresponding author. Submissions that are accepted to WIP are required to send one author to conference and present a poster in the WIP session.

SUBMISSION FORMAT
  • Stage one (Abstract Submission), a title, abstract, and a list of all co-authors must be submitted by November 27. You may also submit the manuscript at this time if ready
  • Stage two (Manuscript Submission), the paper itself is submitted by December 3
  • Designate your submission as a Work-in-Progress submission on the submission site.

Authors are responsible for ensuring that their manuscript submission meets all guidelines and that the PDF is readable. To ensure fairness for all submitters, there will be no grace periods to fix a problematic submission.

SUBMISSION CATEGORIES:

Electronic Design Automation (EDA)

SUBMISSION CATEGORIES FOR EDA PAPERS

EDA1. System-Level Design & Codesign
EDA1.1 System specification, modeling, analysis, simulation, verification, and performance analysis
EDA1.2 Scheduling, HW/SW partitioning, HW/SW interface synthesis
EDA1.3 IP and platform-based design
EDA1.4 Security and IP protection
EDA1.5 Design of Multiprocessor System-On-Chip (MPSOC) and case studies
EDA1.6 Application-specific processor design tools

EDA2. System-Level Communication and Networks-on-Chip
EDA2.1 Modeling and performance analysis
EDA2.2 Communications-based design, communication and network synthesis
EDA2.3 Optimization for energy, fault tolerance, reliability
EDA2.4 Interfacing and software issues, beyond-the-die communication
EDA2.5 NoC design methodologies, case studies and prototyping

EDA3. Power Analysis and Low-Power Design
EDA3.1 System-level power design and thermal management
EDA3.2 System/Architectural low-power techniques: partitioning, scheduling, and resource management
EDA3.3 High-level power estimation and optimization
EDA3.4 Gate-level power analysis and optimization
EDA3.5 Device and circuit techniques for low-power design
EDA3.6 Power-aware and energy-efficient wireless protocols, algorithms and design techniques

EDA4. Verification
EDA4.1 Functional, transaction-level, RTL, and gate-level modeling and verification of hardware design
EDA4.2 Dynamic simulation, equivalence checking, formal (and semiformal) verification model and property checking
EDA4.3 Emulation and hardware simulators or accelerator engines
EDA4.4 Modeling languages and related formalisms, verification plan development and implementation
EDA4.5 Assertion-based verification, coverage analysis, constrained random testbench generation

EDA5. High-Level Synthesis, Logic Synthesis, and FPGAs
EDA5.1 Combinational, sequential and asynchronous logic synthesis
EDA5.2 Library mapping, cell-based design and optimization
EDA5.3 Interactions between logic design and layout or physical synthesis
EDA5.4 High-level, behavioral, algorithmic, and architectural synthesis, "C" to gates tools and methods
EDA5.5 Resource scheduling, allocation, and synthesis
EDA5.6 Logic synthesis and physical design techniques for FPGAs
EDA5.7 Configurable and reconfigurable computing

EDA6. Analog Design and Simulation
EDA6.1 Analog, mixed-signal, and RF design methodologies
EDA6.2 Automated synthesis and optimization of analog designs
EDA6.3 Analog, mixed-signal, and RF simulation
EDA6.4 High-frequency and electromagnetic simulation
EDA6.5 Model order reduction techniques for analog/RF designs
EDA6.6 Substrate noise simulation for analog/RF designs

EDA7. Physical Design and Design Closure
EDA7.1 Floorplanning, partitioning, placement
EDA7.2 Buffer insertion and interconnect planning
EDA7.3 Routing and congestion analysis
EDA7.4 Transistor and gate sizing, local physical synthesis
EDA7.5 Clock network synthesis
EDA7.6 Physical verification and design rule checking
EDA7.7 Physical design of 3-D integrated circuits
EDA7.8 Reticle enhancement, lithography-related design optimizations

EDA8. Analysis of Digital Design
EDA8.1 Deterministic and statistical timing analysis
EDA8.2 Electrical simulation, delay modeling and library characterization
EDA8.3 Electrical and thermal reliability, electrical-thermal simulation
EDA8.4 Power delivery analysis and reduction
EDA8.5 Signal integrity and crosstalk modeling
EDA8.6 Process technology characterization, BEOL extraction, and modeling
EDA8.7 Timing and signal/power integrity analysis of 3-D ICs
EDA8.8 Novel clocking methodologies

EDA9. Test and Reliability
EDA9.1 Test quality/reliability, current based test, delay test, low-power test
EDA9.2 Digital fault modeling, ATPG, DFT, BIST, compression
EDA9.3 Memory / FPGA test and repair
EDA9.4 Fault-tolerance and online testing
EDA9.5 Analog/mixed-signal/RF testing
EDA9.6 Board- and system-level test, system-on-chip (SOC) testing
EDA9.7 Silicon debug and diagnosis, post-silicon design validation
EDA9.8 Soft errors
EDA9.9 Design for resilience under manufacturing variations
EDA9.10 Design for manufacturability, yield, defect tolerance, cost issues, and DFM impact
EDA9.11 Testing of 3-D ICs

EDA10. New and Emerging Design Technologies (including but not restricted to)
EDA10.1 New transistor structures, devices, and novel process technologies
EDA10.2 Nanotechnologies, nanowires, nanotubes
EDA10.3 Optical devices and communication
EDA10.4 Quantum computing
EDA10.5 Biologically-based or biologically-inspired computing systems
EDA10.6 MEMS, sensors, actuators, imaging devices
EDA10.7 Design Automation for System & Synthetic Biology

EDA11. Electronic Design Automation (EDA) Wild and Crazy Ideas (WACI)

Embedded Systems and Software (ESS)

ESS1. Embedded System Specification and Embedded Software
ESS1.1 Embedded systems specification methodologies
ESS1.2 Model- and component-based embedded software design
ESS1.3 Embedded software verification
ESS1.4 Operating systems for embedded systems, middleware and virtual machines
ESS1.5 OS Runtime support for resources management
ESS1.6 Software techniques for multicore, GPU, multithreaded embedded architectures
ESS1.7 Compilation strategies, code transformation and parallelization techniques for embedded systems
ESS1.8 Static and dynamic timing analysis for embedded systems
ESS1.9. Hardware-dependent software
ESS1.10 Customized interfaces and protocols
ESS1.11 I/O management in embedded systems: device drivers, timers, etc.

ESS2. Architectures for Embedded Systems
ESS2.1 Many- and multi-core embedded architectures
ESS2.2 Application-specific platforms and embedded processors (ASIP) design
ESS2.3. Design of heterogeneous distributed embedded systems including wireless sensor networks
ESS2.4 Run-time and design time reconfigurable platforms and processors
ESS2.5 Architectures for self-adaptive computing systems
ESS2.6 On-chip memory architectures and management: scratchpads, compiler controlled memories, etc.
ESS2.7 Custom storage organizations: flash, etc.
ESS2.8 Cyberphysical systems: design, analysis and optimization of networked control and switched control systems, architectures, case studies


ESS3. Embedded System Validation, Verification, Security, Dependability
ESS3.1 Formal verification, validation and testing of embedded systems
ESS3.2 Hardware/software co-validation
ESS3.3 Hardware and software security techniques
ESS3.4 Dependable and safety-critical embedded systems: design and case studies

ESS4. Embedded Systems Design Methodologies
ESS4.1 Modeling embedded constraints: performance, reliability, power, security, etc.
ESS4.2 Early estimation and co-simulation of embedded systems designs
ESS4.3 Multiple-constraint-driven embedded system design exploration, synthesis and optimization
ESS4.4 Design methodologies for pervasive distributed networked embedded systems
ESS4.5 Design methodologies for runtime reconfiguration management, self-adaptive systems and autonomous embedded systems
ESS4.6 System level power management and optimization in embedded systems

ESS5. Embedded Systems and Software (ESS) Wild and Crazy Ideas (WACI)





Q. What is a Work-in-Process (WIP) presentation?

A. The purpose of WIP is to allow the community to participate in an interactive event at DAC, where participants have an opportunity to present and discuss their current work and early results. WIP sessions provide a forum for timely presentations, discussion, and feedback from the community.

Q. What does a WIP submission look like?

A. A WIP submission must have a 100 word abstract, be one page in length, in PDF format, and clearly specify a technical problem, outline a solution, and provide some early results.

Q. What are key dates associated with the WIP submission process?

A. TIMELINE:
October 11 Abstract submission site OPENS
November 27 Abstract deadline: 5:00pm MT (-07:00 GMT)
December 3 Final manuscripts deadline: 5:00pm MT (-07:00 GMT)
January 17 - 23 Author clarification
February 4 A list of accepted manuscripts is posted on the website
February 14 Accept/Reject notification
March 18 Speaker registration and Copyright form deadline.
March 28 Final manuscript is DUE to the proceedings publisher by 5:00pm MT (-07:00 GMT).
May 7 Draft speaker presentation slides deadline
May 17 Receive feedback on speaker slides from Session Chair
May 21 Speaker bios are DUE to the DAC Navigation Center
June 2 The Design Automation Conference begins!

Q. Who judges the submissions?

A. The Technical Program Committee for the research track and the embedded track will review the submissions, with the assistance of select expert reviewers.

Q. What criteria are used to judge WIP submissions?

A. DAC-relevant motivation and context, clarify of problem statement, and promise of solution.

Q. Do you have a sample of a WIP submission to reference?

A. Yes, Please go to the DAC Archives for previously accepted submissions. Please go to the 2012 49th DAC as this is the first year WIP appears in the archive.

Q. I checked the box for a WIP presentation if my paper is not accepted as a research manuscript. What does it mean?

A. If the TPC subcommittee does not accept your manuscript as a research manuscript at DAC 2013, they will decide if your manuscript meets the requirements as WIP. In this case you will be invited to present during a specific poster sessions at DAC, but the manuscript will not be published in the DAC proceedings.

Q. Who do I contact for more information?

A. For additional information, please contact Donatella Sciuto or Chuck Alpert, 50th DAC Technical Program Co-Chairs.


ABSTRACT SUBMISSION:
-CLOSED-

November 27, 2012 


MANUSCRIPT SUBMISSION -CLOSED-
December 3, 2012 
 

Access your DAC Navigation Center

You can view previously accepted research manuscripts on the DAC Archive. 


IMPORTANT COPYRIGHT FORM INFORMATION:
All papers that are submitted to DAC for publication in the official conference proceedings will be required by ACM to sign a copyright form.  A sample copy of the ACM Copyright form can be found here so that authors can get the approval process started with their organizations.  This copyright sample is for your information only.  Authors will be required to complete an electronic version of this form through the ACM submission system in February if their paper is accepted. 

Please note: Paper forms are no longer accepted and ACM will not accept any addenda to this form.

Any issues/questions authors have regarding the copyright form or ACM Policy may be addressed to RightsReview@acm.org
Design Automation Conference Sponsors IEEE Solid State Circuits Society Electronic Design Automation Consortium CEDA - IEEE Council on Electronic Design Automation SIGDA Special Interest Group - Design Automation