2021 SkyTalk Speakers
View the Entire 2021 Conference Program
Cloud & AI Technologies for Faster, Secure Semiconductor Supply Chains
Monday, December 6, 2021 | 1:00 PM - 1:45 PM
Semiconductors are deeply embedded in every aspect of our lives, and recent security threats and global supply chain challenges have put a spotlight on the industry. Significant investments are being made both by nation states and commercial industry, to manage supply chain dependencies, ensure integrity and build secure, collaborative environments to foster growth. These shifts provide unique opportunities for our industry. This talk blends insights and experiences from government initiatives and Azure's Special Capabilities & Infrastructure programs, to outline how Cloud + AI technologies, along with tool vendors, fabless semiconductor companies, IP providers, foundries, equipment manufacturers and other ecosystem stakeholders can contribute to building a robust, end-to-end, secure silicon supply chain for both commercial and government applications, while generating value for their businesses.
Dr. William Chappell is the CTO of Azure Global. He is currently bootstrapping efforts for Microsoft in Space, Critical Infrastructure, and Secure Hardware Design. He was formerly the director of the Defense Advanced Research Projects Agency (DARPA) Microsystems Technology Office (MTO). Serving in this position, he focused the office on three key thrusts important to National Security. These thrusts included ensuring unfettered use of the electromagnetic spectrum, building an alternative business model for acquiring advanced DoD electronics that feature built-in trust, and developing circuit architectures for next-generation machine learning. He created and kicked off the Electronics Resurgence Initiative (ERI), the nation’s largest investment in the foundation of electronics. Also, as office director, he helped structure and authorize the Spectrum Collaboration Challenge (SC2), the first DARPA RF grand challenge, continuing his focus on adaptive and collaborative RF systems. As a program manager at DARPA, he led efforts on adaptive and high-performance RF systems. He developed the arrays at commercial timescales (ACT) and managed the Adaptive RF Technologies (ART) portfolio. These activities led to next generation RF components and systems, such as the RF FPGA, and ultra-high-speed digitizers for direct RF sampling. Prior to his DARPA appointment, Dr. Chappell served as a professor in the Electrical and Computer Engineering Department of Purdue University, where he led the Integrated Design of Electromagnetically Applied Systems (IDEAS) Laboratory. Dr. Chappell’s research focused on high-frequency components, specifically the unique integration of RF and microwave components based on electromagnetic analysis. Dr. Chappell is the recipient of numerous research and teaching awards. He received his Bachelor of Science (summa cum laude), Master of Science, and Doctor of Philosophy degrees in Electrical Engineering, all from the University of Michigan.
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Bio will be available shortly.
Cross-Disciplinary innovations Required for the Future of Computing
Wednesday, December 8, 2021 | 1:00 PM - 1:45 PM
With traditional drivers of compute performance a thing of the past, innovative engineers are tapping into new vectors of improvement to meet the world's demand for computation. Like never before, the future of computing will be owned by those who can optimize across the previously siloed domains of silicon design, processor architecture, package technology and software algorithms to deliver performance gains with new capabilities. These approaches will derive performance and power efficiency through tailoring of the architecture to particular workloads and market segments, leveraging the much greater performance/Watt and performance/area of accelerated solutions. Designing and verifying multiple tailored solutions for markets where a less efficient general purpose design formerly sufficed can be accomplished through modular architectures using 2.5D and 3D packaging approaches. Delivering on modular solutions for high volume markets requires simultaneously optimizing across packaging, silicon, interconnect technologies where in the past, silicon design was sufficient. This talk will cover these trends with the vectors of innovation required to deliver these next generation compute platforms.
Samuel Naffziger is AMD senior vice president, Corporate Fellow, and Product Technology Architect. Naffziger works across the company to optimize product technology choices and deployment with a continued focus on driving best practice power/performance/area methodology to maximize product competitiveness, efficiency, and cost. Naffziger has been the lead innovator behind many of AMD’s low-power features and chiplet architecture. He has over 32 years of industry experience with a background in microprocessors and circuit design at Hewlett Packard, Intel and AMD. Naffziger received a Bachelor of Science degree in Electrical Engineering from the California Institute of Technology (CalTech) and a Master of Science from Stanford. Naffziger holds more than 130 U.S. patents in the field and authored dozens of publications and presentations on processors, architecture and power management. He is an IEEE Fellow.