Huiming Bu is vice president of IBM Global Semiconductors R&D and Albany Operation. He has 20+ years of professional experience in semiconductor technology R&D at IBM after he received his Ph.D. in Electrical Engineering from Yale University. Huiming started his technical career at IBM on High-κ/Metal Gate project and then led SOI FinFET research for IBM’s 14nm node technology. After that, Huiming and his team delivered 10nm/7nm technology nodes and are now focusing on 2nm/1.4nm development. Huiming also leads Pathfinding R&D to enable the path to 7A technology and beyond for IBM and its Joint Development Alliance (JDA) partners. In his current role, Huiming is responsible for global IBM Semiconductors R&D strategy across world-wide labs. He oversees R&D activities in advanced logic, chiplet and advanced packaging, emerging memory and analog AI hardware. In addition to driving semiconductor technology R&D agenda, Huiming is also responsible for IBM Research Albany site and fab operations. Huiming has authored/co-authored 100+ technical publications and holds 100+ patents in semiconductor area.