Design on Cloud

Systems and semiconductor companies realize the benefits of the cloud and how designing in the cloud can greatly accelerate their design cycle.  Semiconductor design simulation, verification, lithography, metrology, yield analysis, and many other workloads benefit from the scalability and performance of cloud design.

For all aspects of semiconductor design and manufacturing, the new era of design in the cloud, can optimize the process and increase yields. Industrial IoT, data lake, analytics, and machine learning solutions allow you to develop smart factories and products, provide insights to increase your operational efficiency, and accelerate your pace of innovation.

The Design on Cloud sessions will focus on the aspects mentioned above plus high performance design, verification, and smart manufacturing, supporting electronic design automation (EDA) in the cloud.

Call For Contributions

Research Paper Abstract Submission Deadline: November 21
Research Paper Manuscript Submission Deadline: November 27

View specific research paper submission categories.

Invited Session Proposals Deadline: November 27

View proposal information for Special Sessions/Invited Presentations, Panels, Workshops, Tutorials, and Colocated Conferences.

Designer Track and IP Track Presentation Submission Deadline: January 22, 2020

View specific Designer Track Submission Categories and IP Track Submission Categories.

Embedded Systems Track Submission Deadline: January 22, 2020

View more info.